Group Lead
Stoyan Stoyanov
Reader in Computational Engineering and Optimisation
Contact details
The Computational Mechanics and Reliability Group (CMRG) has research interests in the development and application of computer models for multi-physics/multi-scale predictions, numerical optimisation, physics-of-failure analysis, reliability and quality assessments, and maintenance of engineering structures. The group is also active in research on industrial data analytics and computational intelligence technologies. A particular focus of its modelling research is applied to microelectronics manufacturing and test, and to electronic components and microsystems. Under the direction of Dr Stoyan Stoyanov, the group is one of the main contributors to the Centre for Advanced Simulation and Modelling (CASM).
Publications
As a research team we publish in high ranking journals and present our work at international conferences. Since 2004 the group has authors over 300 papers. Further details on our publication can be found on GALA.
Recent publications
Article
Stoyanov, Stoyan , Bailey, Chris, Microchip Technology Inc., Amethyst Research (2023), Modeling Insights into the assembly challenges of focal plane arrays. IEEE. In: , , , . IEEE, IEEE Access . pp. 35207-35219 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2023.3264806).
Santhanakrishnan, Mani Sekaran , Tilford, Timothy, Bailey, Christopher (2022), Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3) . pp. 1203-1228 ISSN: 0961-5539 (Print), (doi: https://doi.org/10.1108/HFF-06-2022-0386).
Xu, Yilun , Xian, Jingwei, Stoyanov, Stoyan, Bailey, Christopher , Coyle, Richard , Gourlay, Christopher , Dunne, Fionn , Nokia Bell Labs, Murray Hill, New Jersey, USA (2022), A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. Elsevier. In: , , , . Elsevier, International Journal of Plasticity, 155: 103308 ISSN: 0749-6419 (Print), (doi: https://doi.org/10.1016/j.ijplas.2022.103308).
Santhanakrishnan, Mani Sekara , Tilford, Tim, Bailey, Chris (2021), Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks. Emerald. In: , , , . Emerald, International Journal of Numerical Methods for Heat and Fluid Flow, 32 (3) . pp. 1025-1045 ISSN: 0961-5539 (Print), (doi: https://doi.org/10.1108/HFF-10-2020-0656).
Tilford, Tim , Stoyanov, Stoyan, Braun, Jessica, Janhsen, Jan Christoph , Patel, Mayur K. , Bailey, Chris (2021), Comparative reliability of inkjet-printed electronics packaging. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2) . pp. 351-362 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2021.3049952).
Hinojosa Herrera, Ana , Walshaw, Chris, Bailey, Chris (2020), Failure mode & effect analysis and another methodology for improving data veracity and validity. International Association of Educators and Researchers (IAER). In: , , , . International Association of Educators and Researchers (IAER), Annals of Emerging Technologies in Computing (AETiC), 4 (3) . pp. 9-16 ISSN: 2516-0281 (Print), (doi: https://doi.org/10.33166/AETiC.2020.03.002).
Rajaguru, Pushpa , Lu, Hua, Bailey, Chris, Bella, Martina (2020), Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 110: 113697 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2020.113697).
Stoyanov, Stoyan , Bailey, Christopher, Stewart, Paul, Parker, Mike , Roulston, John F. , Leonardo MW Ltd , Micross Components (2020), Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE. In: , , , . IEEE, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3) . pp. 502-515 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2020.2972635).
Shahjalal, Mohammad , Rishad Ahmed, MD, Lu, Hua, Bailey, Chris , Forsyth, Andrew (2020), An analysis of the thermal interaction between components in power converter applications. IEEE. In: , , , . IEEE, IEEE Transactions on Power Electronics, 35 (9) . pp. 9082-9094 ISSN: 0885-8993 (Print), 1941-0107 (Online) (doi: https://doi.org/10.1109/TPEL.2020.2969350).
Ahsan, M. , Stoyanov, S., Bailey, C., Albarbar, A. (2020), Developing computational intelligence for smart qualification testing of electronic products. IEEE. In: , , , . IEEE, IEEE Access, 8 . pp. 16922-16933 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2020.2967858).
Hinojosa Herrera, Ana Elsa , Stoyanov, Stoyan, Bailey, Christopher, Walshaw, Christopher , Yin, Chunyan (2019), Data analytics to reduce stop-on-fail test in electronics manufacturing. De Gruyter Open. In: , , , . De Gruyter Open, Open Computer Sciences, 9 (1) . pp. 200-211 2299-1093 (Online) (doi: https://doi.org/10.1515/comp-2019-0014).
Bailey, Christopher , Yin, Chunyan, Rajaguru, Pushparajah (2019), Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE. In: , , , . IEEE, IEEE ACCESS, 7 . pp. 54658-54669 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2019.2911260).
Tonry, Catherine E. H. , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. , Bailey, Christopher (2019), Fabrication of hollow polymer microstructures using dielectric and capillary forces. Springer Berlin Heidelberg. In: , , , . Springer Berlin Heidelberg, Microsystem Technologies . pp. 1-8 ISSN: 0946-7076 (Print), 1432-1858 (Online) (doi: https://doi.org/10.1007/s00542-019-04409-z).
Stoyanov, Stoyan , Ahsan, Mominul, Bailey, Chris, Wotherspoon, Tracy , Hunt, Craig , Microchip Technology Inc. (2019), Predictive analytics methodology for smart qualification testing of electronic components. Springer US. In: , , , . Springer US, Journal of Intelligent Manufacturing, 30 (3) . pp. 1497-1514 ISSN: 0956-5515 (Print), 1572-8145 (Online) (doi: https://doi.org/10.1007/s10845-018-01462-9).
Book section
Flynn, David , Bailey, Christopher, Rajaguru, Pushpa, Wenshuo, Tang , Yin, Chunyan (2019), Prognostics and health management of subsea cables. Wiley-Blackwell. In: , , In: Douglas Goodman, James P. Hofmeister, Ferenc Szidarovszky (eds.), Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Dat. Wiley-Blackwell, . ISBN: 9781119356653 (doi: ) NB Item availability restricted.
Conference item
Malik, Asif , Rajaguru, Pushparajah, Azzawi, Rula (2022), Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE , . , (doi: https://easychair.org/cfp/ITT2022).
Conference proceedings
Stoyanov, Stoyan and , Bailey, Chris (2022), Deep learning modelling for composite properties of PCB conductive layers. Institute of Electrical and Electronics Engineers (IEEE). In: , , , 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey (1st) . pp. 1-7 . ISBN: 9781665458375 (doi: https://doi.org/10.1109/EuroSimE54907.2022.9758885).
Stoyanov, Stoyan , Stewart†, Paul, Bailey, Christopher (2021), Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. Institute of Electrical and Electronics Engineers (IEEE). In: , , In: Paul Stewart (ed.), 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey (1st) . pp. 1-8 . ISBN: 9780956808677 ; 9781665423687 (doi: https://doi.org/10.23919/EMPC53418.2021.9584970).
Hinojosa Herrera, Ana Elsa , Walshaw, Chris, Bailey, Chris (2020), Improving Black Box Classification Model Veracity for Electronics Anomaly Detection. IEEE. In: , , , 2020 15th IEEE Conference on Industrial Electronics and Applications (ICIEA. IEEE, . pp. 1092-1097 . ISBN: 9781728151694ISSN: 2156-2318 (Print), 2158-2297 (Online) (doi: https://doi.org/10.1109/ICIEA48937.2020.9248258) NB Item availability restricted.
Stoyanov, Stoyan , Bailey, Christopher, Waite, Rhys, Hicks, Christopher , Golding, Terry , Microchip Technology Inc (Microsemi) , Amethyst Research Inc (2020), Packaging challenges and reliability performance of compound semiconductor focal plane arrays. IEEE. In: , , , 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC. IEEE, . pp. 1-8 . ISBN: 9780956808660 (doi: https://doi.org/10.23919/EMPC44848.2019.8951842).
Hinojosa Herrera, Ana Elsa , Walshaw, Chris, Bailey, Chris, Yin, Chunyan (2019), Failure mode & effect analysis for improving data veracity and validity. IEEE. In: , , In: Mahdi H. Miraz, Peter S. Excell, Andrew Ware, Safeeullah Soomro, Maaruf Ali (eds.), Proceedings of the IEEE International Conference on Computing, Electronics & Communications Engineering 2019 (IEEE iCCECE '19. IEEE, . pp. 100-105 . ISBN: 9781728121383 (doi: https://doi.org/10.1109/iCCECE46942.2019.8941849).
Rajaguru, Pushparajah , Santhanakrishnan, Manisekaran, Tilford, Tim, Bailey, Chris (2019), Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. IEEE. In: , , , 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC. IEEE, . ISBN: 9781728120782ISSN: 2474-1515 (Print), 2474-1523 (Online) (doi: https://doi.org/10.1109/THERMINIC.2019.8923530).
Hinojosa Herrera, Ana Elsa and , Stoyanov, Stoyan (2019), Data driven predictive model to compact a production stop-on-fail test set for an electronic device. IEEE Xplore. In: , , , Proceedings of the 2018 International Conference on Computing, Electronics & Communications Engineering (iCCECE. IEEE Xplore, . pp. 59-64 . ISBN: 9781538649046 (doi: https://doi.org/10.1109/iCCECOME.2018.8658941).