Key details
Dr Pushparajah Rajaguru
Lecturer in Computer Science
He received his MPhil degree in computational mathematics from Salford and obtained his PhD in computational modelling at Greenwich in 2011. He was a research fellow in computational engineering in 2011 and then become a lecturer in industrial mathematics in 2013. In September 2022 he became a Lecturer in Computer Science.
Since 2011, he worked in many research and consultancy projects focusing on wide variety of application ranging from micro level structure such as microelectronic and power electronic modulus reliability modelling to macro level structure such as structural analysis of historic ships.
Responsibilities within the university
Lecturer in Computing
Mid-Career Researcher
Awards
University Award (Undergraduate)
Recognition
Member of The Institute of Mathematics and its Application (IMA)
Associate Fellow of Higher Education Academy
Research / Scholarly interests
- Design optimisation/topology optimisation, numerical risk analysis techniques and surrogate modelling in application of microelectronic systems and power electronic modules.
- Finite element modelling and reliability prediction in power electronic modules.
- Structural mechanical analysis of historic ship and subsea power cable.
- Machine and deep learning application in Power electronics reliability.
- Model order reduction in reliability prediction.
Key funded projects
3D-Mintegration: The design and manufacture of 3D integrated miniaturised product. EPSRC grand challenge project involving group of universities - Brunel, Cambridge, Cranfield, Greenwich, Heriot-Watt, Loughborough, Nottingham, and National Physical Laboratory.
MEDWAY QUEEN Structural Analysis: KTP project of structural analysis on Medway Queen paddle steamer ship funded by South East England Development Agency (SEEDA).
Power Module Reliability (PEMREL): European Union funded project which focused on developing design tools for power electronic module.
Subsea Cable Condition Monitoring: Reliability prediction of subsea power cable funded by Scottish and Southern Energy (SSE).
Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT): Engineering and Physical Science Research Council (EPSRC funded project in power electronic module).
Centre for Power Electronics, UK: EPSRC through the Underpinning Power Electronics HUB. It supports the cross theme project: Compact and Efficient off-line LED Drivers Using 800V Lateral IGBTs and Chip-On-Board Assembly.
Recent publications
Article
Hassan, Sheikh , Rajaguru, Pushparajah, Stoyanov, Stoyan, Bailey, Chris , Tilford, Timothy (2024), Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. Elsevier. In: , , , . Elsevier, Power Electronic Devices and Components: 100063 2772-3704 (Online) (doi: https://doi.org/10.1016/j.pedc.2024.100063).
Rajaguru, Pushpa , Tilford, Tim, Bailey, Chris, Stoyanov, Stoyan (2023), Damage mechanics-based failure prediction of wirebond in power electronic module. Institute of Electrical and Electronics Engineers (IEEE). In: , , , . Institute of Electrical and Electronics Engineers (IEEE), IEEE Access ISSN: 2169-3536 (Print), (doi: https://doi.org/10.1109/ACCESS.2023.3342689).
Rajaguru, Pushpa , Lu, Hua, Bailey, Chris, Bella, Martina (2020), Modelling and analysis of vibration on power electronic module structure and application of model order reduction. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 110: 113697 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2020.113697).
Bailey, Christopher , Yin, Chunyan, Rajaguru, Pushparajah (2019), Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE. In: , , , . IEEE, IEEE ACCESS, 7 . pp. 54658-54669 2169-3536 (Online) (doi: https://doi.org/10.1109/ACCESS.2019.2911260).
Rajaguru, Pushpa , Lu, Hua, Bailey, Chris (2019), Time integration damage model for Sn3.5Ag solder interconnect in power electronic module. IEEE. In: , , , . IEEE, IEEE Transactions on Device and Materials Reliability, 19 (1) ISSN: 1530-4388 (Print), 1558-2574 (Online) (doi: https://doi.org/10.1109/TDMR.2019.2891949).
Rajaguru, P. , Lu, H., Bailey, C., Castellazzi, A. , Pathirana, V. , Udugampola, N. , Udrea, F. (2018), Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 83 . pp. 146-156 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2018.02.024).
Rajaguru, Pushparajah , Ortiz-Gonzalez, Jose Angel, Lu, Hua, Bailey, Chris , Alatise, Olawiwola (2017), A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications. Institute of Electrical and Electronics Engineers (IEEE). In: , , , . Institute of Electrical and Electronics Engineers (IEEE), IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (6) . pp. 893-900 ISSN: 2156-3950 (Print), 2156-3985 (Online) (doi: https://doi.org/10.1109/TCPMT.2017.2688021).
Ortiz Gonzalez, Jose , Alatise, Olayiwola, Aliyu, Attahir, Rajaguru, Pushparajah , Castellazzi, Alberto , Ran, Li , Mawby, Philip , Bailey, Chris (2017), Evaluation of SiC Schottky diodes using pressure contacts. Institute of Electrical and Electronics Engineers (IEEE). In: , , , . Institute of Electrical and Electronics Engineers (IEEE), IEEE Transactions on Industrial Electronics, 64 (10) . pp. 8213 -8223 ISSN: 0278-0046 (Print), 1557-9948 (Online) (doi: https://doi.org/10.1109/TIE.2017.2677348).
Rajaguru, P. , Lu, H., Bailey, C., Ortiz-Gonzalez, J. , Alatise, O. (2016), Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Elsevier. In: , , , . Elsevier, Microelectronics Reliability, 68 . pp. 77-85 ISSN: 0026-2714 (Print), (doi: https://doi.org/10.1016/j.microrel.2016.12.002).
Book section
Flynn, David , Bailey, Christopher, Rajaguru, Pushpa, Wenshuo, Tang , Yin, Chunyan (2019), Prognostics and health management of subsea cables. Wiley-Blackwell. In: , , In: Douglas Goodman, James P. Hofmeister, Ferenc Szidarovszky (eds.), Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Wiley-Blackwell, . ISBN: 9781119356653 (doi: ) NB Item availability restricted.
Conference item
Malik, Asif , Rajaguru, Pushparajah, Azzawi, Rula (2022), Smart manufacturing with Artificial Intelligence and digital twin: a brief review. In: 8th International Conference on Information Technology Trends, 25th - 26th May 2022, Dubai, UAE , . , (doi: https://easychair.org/cfp/ITT2022).
Conference proceedings
Hassan, Sheikh , Stoyanov, Stoyan, Rajaguru, Pushparajah, Bailey, Christopher (2024), Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. Institute of Electrical and Electronics Engineers (IEEE). In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 11th - 13th September, Berlin, Germany In: ESTC/IEEE 2024 Conference Committee (ed.), 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey (1st) . pp. 1-8 . ISBN: 9798350390360ISSN: 2687-9700 (Print), 2687-9727 (Online) (doi: https://doi.org/10.1109/ESTC60143.2024.10712079).
Hassan, Sheikh , Rajaguru, Pushparajah, Stoyanov, Stoyan, Bailey, Christopher (2024), Thermal-mechanical analysis of a power module with parametric model order reduction. The Institute of Electrical and Electronics Engineers (IEEE). In: , , In: EMPC Conference Committee (ed.), 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey (1st) . pp. 1-6 . ISBN: 9780956808691; 9781665487368 (doi: https://doi.org/10.23919/EMPC55870.2023.10418328).
Hassan, Sheikh , Rajaguru, Pushparajah, Stoyanov, Stoyan, Bailey, Christopher (2023), Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. Institute of Electrical and Electronics Engineers IEEE. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE), , In: ISSE International Spring Seminar on Electronics (ed.), 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ (1st) . pp. 1-7 . ISBN: 9798350334845; 9798350334852ISSN: 2161-2528 (Print), 2161-2536 (Online) (doi: https://doi.org/10.1109/ISSE57496.2023.10168468).
Rajaguru, Pushparajah , Bailey, Christopher, Bella, Martina (2021), Applying model order reduction to the reliability prediction of power electronic module wire bond structure. IEEE. In: , , In: Therminic 2021 - IEEE Steering Committee, Bernhard Wunderle (eds.), 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US . ISBN: 9781665418973ISSN: 2474-1515 (Print), 2474-1523 (Online) (doi: https://doi.org/10.1109/THERMINIC52472.2021.9626396).
Rajaguru, Pushparajah , Santhanakrishnan, Manisekaran, Tilford, Tim, Bailey, Chris (2019), Design of additively manufactured heatsinks for power electronics thermal management using adjoint level-set topology optimization. IEEE. In: , , , 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, . ISBN: 9781728120782ISSN: 2474-1515 (Print), 2474-1523 (Online) (doi: https://doi.org/10.1109/THERMINIC.2019.8923530).
Hua, Lu , Rajaguru, Pushparajah, Bailey, Christopher (2018), A numerical procedure for the optimization of IGBT module packaging. Institute of Electrical and Electronics Engineers (IEEE). In: 19th International Conference on Electronic Packaging Technology (ICEPT), 11/08/2018, Shanghai, China In: Tianchun Ye, Fei Xiao, Jun Wang, Lin Chen (eds.), 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey (18553) (1st) . pp. 156-160 . ISBN: 9781538663868; 9781538663851; 9781538663875 (doi: https://doi.org/10.1109/ICEPT.2018.8480746).
Bailey, C. , Rajaguru, P., Lu, H., Castellazzi, A. , Antonini, M. , Pathirana, V. , Udugampola, N. , Udrea, F. , Mitchelson, P. D. , Aldhaher, S. (2018), Mechanical modelling of high power lateral IGBT for LED driver applications. IEEE Electronics Packaging Society (formerly CPMT). In: IEEE 68 Electronic Components and Technology Conference, 29/05/2018, San Diego, CA , IEEE Electronic Components and Technology Conference (ECTC). IEEE Electronics Packaging Society (formerly CPMT), . pp. 1375-1381 . ISBN: 9781538650004 2377-5726 (Online) (doi: https://doi.org/10.1109/ECTC.2018.00210).
Rajaguru, P. , Bailey, C., Lu, H., Aliyu, A. M. , Castellazzi, A. , Pathirana, V. , Udugampola, N. , Trajkovic, T. , Udrea, F. , Mitcheson, P. D. (2017), Co-design/simulation of flip-chip assembly for high voltage IGBT packages. THERMINIC. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, September 2017, Amsterdam /NL , 23rd International workshop on Thermal Investigations of ICs and Systems (THERMINIC). THERMINIC, . pp. 1-5 (doi: http://www.therminic2017.eu) NB Item availability restricted.
Aliyu, A. M. , Mouawad, B., Castellazzi, A., Rajaguru, P. , Bailey, C. , Pathirana, V. , Uduampola, N. , Trajkovic, T. , Ubrea, F. (2017), Chip-on-board assembly of 800V Si LIGBTs for high performance ultra-compact LED drivers. IEEE. In: 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD), 28 May-1 June 2017, Sapporo, Japan , Proceedings of the 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, . pp. 431-434 . ISBN: 9784886860941 1946-0201 (Online) (doi: https://doi.org/10.23919/ISPSD.2017.7988976).
Rajaguru, P. , Lu, H., Bailey, C., Ortiz-Gonzalez, J. , Alatise, O. (2016), Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. IEEE. In: 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 30 Sept.-2 Oct. 2015, Paris, France , 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, . pp. 1-6 . ISBN: 9781467397063 (doi: https://doi.org/10.1109/THERMINIC.2015.7389607).